首页> 外文OA文献 >Future semiconductor detectors using advanced microelectronics with post-processing, hybridization and packaging technology

【2h】

Future semiconductor detectors using advanced microelectronics with post-processing, hybridization and packaging technology

机译：未来的半导体探测器将使用具有后处理，杂交和封装技术的先进微电子技术

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Heijne, Erik H M;
展开▼
作者单位

展开▼
年度 2004
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Future semiconductor detectors using advanced microelectronics with post-processing, hybridization and packaging technology [J] . Erik H.M. Heijne Nuclear Instruments & Methods in Physics Research. Section A, Accelerators, Spectrometers, Detectors and Associated Equipment . 2005,第1a2期

机译：未来的半导体探测器将使用具有后处理，杂交和封装技术的先进微电子技术
2. Radiation hardness trends in new microelectronic technologies for the readout of semiconductor detectors [J] . Valerio Re Nuclear Instruments & Methods in Physics Research. Section A, Accelerators, Spectrometers, Detectors and Associated Equipment . 2013,第deca1期

机译：用于半导体探测器读出的新微电子技术的辐射硬度趋势
3. Materials and Processes of Microelectronic Packaging including Low-Temperature Cofired Ceramics Technology (Past, Present and Future) [J] . Imanaka Y. Journal of Ceramic Science and Technology . 2015,第4期

机译：微电子包装材料和过程，包括低温COFired陶瓷技术（过去，现在和未来）
4. Future Perspective of Materials and Processes of LTCC Technology Beyond Microelectronics Packaging [C] . Yoshihiko IMANAKA IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies . 2015

机译：超越微电子包装超出LTCC技术的材料和过程的未来视角
5. Advanced transducer technologies for electrical connections in microelectronic packaging. [D] . Li, Hing Leung. 2004

机译：用于微电子封装中电连接的先进换能器技术。
6. Advanced technologies for future ground-based laser-interferometric gravitational wave detectors [O] . Giles Hammond, Stefan Hild, Matthew Pitkin -1

机译：未来的地面激光干涉重力波探测器的先进技术
7. Special Articles: Theme of Advanced Assembly and Packaging Technology. Subject Imposed on Hybrid Microelectronics Engineers. [O] . Takashi NUKII 1992

机译：特殊文章：先进的装配和包装技术主题。对混合体微电子工程师施加的主题。

Future semiconductor detectors using advanced microelectronics with post-processing, hybridization and packaging technology

著录项

引文网络

相似文献

相关主题

期刊订阅